The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2013
Filed:
Jun. 22, 2010
Hyung Wook Park, Suwon-si, KR;
Young Chang Joo, Seoul, KR;
Hong Seok Min, Yongin-si, KR;
Young Gwan Ko, Seoul, KR;
Chang Sup Ryu, Yongin-si, KR;
Ho Young Lee, Seoul, KR;
Shin Bok Lee, Paju-si, KR;
Min Suk Jung, Incheon, KR;
Hyung Wook Park, Suwon-si, KR;
Young Chang Joo, Seoul, KR;
Hong Seok Min, Yongin-si, KR;
Young Gwan Ko, Seoul, KR;
Chang Sup Ryu, Yongin-si, KR;
Ho Young Lee, Seoul, KR;
Shin Bok Lee, Paju-si, KR;
Min Suk Jung, Incheon, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
SNU R&DB Foundation, Seoul, KR;
Abstract
Disclosed herein are a printed circuit substrate and a method of manufacturing the same. The printed circuit substrate includes an insulating layer, and a circuit layer that includes a circuit pattern disposed on the insulating layer and a barrier layer that is disposed to cover at least one surface of the circuit pattern and suppresses electrochemical migration from the circuit pattern, thereby making it possible to achieve high-density and secure reliability, and the method of manufacturing the same.