Shiki Ueki

Title: Shiki Ueki: Innovator in Multilayer Substrate Technology

Introduction

Shiki Ueki is a prominent inventor based in Shizuoka-ken, Japan. He has made significant contributions to the field of multilayer substrate technology, holding a total of six patents. His innovative approaches have advanced the production methods of various electronic components.

Latest Patents

Ueki's latest patents include a method for producing multilayer substrates and a desmearing method. The multilayer substrate production method involves several steps, including a base-material pretreatment step, a hole forming step, and a metal adhesion step. This process allows for the effective creation of multilayer substrates with enhanced performance. Additionally, his desmearing method utilizes plasma etching to clean the core base material, followed by a plating step that applies a plating catalyst to the insulating layer.

Another notable invention is the conductive substance-adsorbing resin film, which allows for the easy formation of a conductive layer with excellent adhesion to the resin film. This invention also includes a method for producing a metal layer-coated resin film, which is essential for creating high-definition printed wiring boards.

Career Highlights

Throughout his career, Shiki Ueki has worked with notable companies such as Fujifilm Corporation and Fuji Photo Film Company, Limited. His experience in these organizations has contributed to his expertise in the field of electronic materials and substrate technology.

Collaborations

Ueki has collaborated with several professionals in his field, including Kazumori Minami and Mitsuyuki Tsurumi. These collaborations have further enriched his work and led to advancements in multilayer substrate technology.

Conclusion

Shiki Ueki's innovative contributions to multilayer substrate technology and his extensive patent portfolio highlight his significant impact on the industry. His work continues to influence the development of advanced electronic components.