The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2014

Filed:

Aug. 16, 2013
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Shiki Ueki, Ashigara-kami-gun, JP;

Takeshi Hama, Ashigara-kami-gun, JP;

Takeyoshi Kano, Ashigara-kami-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 9/00 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H05K 3/42 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4685 (2013.01); H05K 3/4652 (2013.01); H05K 3/421 (2013.01); H05K 3/108 (2013.01); H05K 3/423 (2013.01);
Abstract

A method for producing a multilayer substrate involves: a base-material pretreatment step in which a hole forming step and a metal adhesion step are performed in no particular order, the hole forming step being a step of subjecting a core base material having at least an insulating layer and a first metal layer to a hole opening process, the metal adhesion step being a step in which a predetermined metal or metal ion is made to adhere to the other surface of the insulating layer; a desmearing step of performing desmearing by plasma etching; a cleaning step of cleaning the core base material by using an acidic solution; and a plating step of applying a plating catalyst or a precursor thereof onto the insulating layer and performing plating.


Find Patent Forward Citations

Loading…