Shikai Wu

Title: Innovations of Shikai Wu in Additive Manufacturing

Introduction

Shikai Wu is a prominent inventor based in Beijing, China. He has made significant contributions to the field of additive manufacturing, particularly through his innovative approaches to semi-solid processes. His work is characterized by a focus on enhancing manufacturing techniques to improve efficiency and product quality.

Latest Patents

Shikai Wu holds a patent for a micro-region semi-solid additive manufacturing method. This method utilizes rod-shaped materials as consumables, where the front ends are heated using high-energy beams, electric arcs, or resistance heat. This heating allows the front ends to reach a semi-solid state, enabling the coexistence of solid and liquid phases. The process involves applying rotational torsion and axial thrust to the consumables, which facilitates shearing, agitation, and extrusion of the semi-solid front ends. This innovative approach allows for mold-free semi-solid rheoforming, leading to the formation of metallurgical bonds with the bottom layer metal. The stacking process is repeated according to a planned route, resulting in the creation of objects or stack layers in special shapes.

Career Highlights

Shikai Wu is affiliated with the Beijing University of Technology, where he continues to advance research in additive manufacturing. His work has garnered attention for its potential applications in various industries, including aerospace and automotive sectors. His innovative methods are paving the way for more efficient manufacturing processes.

Collaborations

Shikai Wu has collaborated with notable colleagues, including Wuxiong Yang and Jianglin Zou. These collaborations have further enriched his research and contributed to the development of cutting-edge technologies in the field.

Conclusion

Shikai Wu's contributions to additive manufacturing through his patented methods exemplify the innovative spirit of modern engineering. His work not only enhances manufacturing techniques but also opens new avenues for future research and application.