The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 2022
Filed:
Jan. 13, 2020
Beijing University of Technology, Beijing, CN;
Wuxiong Yang, Beijing, CN;
Jianglin Zou, Beijing, CN;
Jiejie Xu, Beijing, CN;
Shikai Wu, Beijing, CN;
Beijing University Of Technology, Beijing, CN;
Abstract
A micro-region semi-solid additive manufacturing method is provided, where rod-shaped materials are used as consumables, and front ends of the consumables are heated by means of high-energy beam, an electric arc, a resistance heat, or the like, to enable the front ends to be in a semi-solid state in which the solid-liquid two phases coexist; at the same time, the rotational torsion and the axial thrust are applied to the consumables to perform shearing, agitation and extrusion on the semi-solid front ends, that is, the mold-free semi-solid rheoforming is performed. The consumable is transmitted to the bottom layer metal continuously in this manner to form metallurgical bonding, the stacking process is repeated according to a planned route obtained after discretization slicing treatment, and then an object or a stack layer in a special shape can be formed.