Shih-Yung Peng

Title: Innovations of Shih-Yung Peng

Introduction

Shih-Yung Peng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging. His innovative work has led to advancements in the efficiency and effectiveness of package structures.

Latest Patents

Shih-Yung Peng holds a patent for the "Structure and formation method of package structure with fan-out structure." This patent describes a method that includes forming a conductive structure over a carrier substrate and disposing a semiconductor die over the carrier substrate. The method also involves pressing a protective substrate against the carrier substrate at an elevated temperature to bond the protective substrate to the conductive structure. Additionally, it includes forming a protective layer to surround the semiconductor die. He has 1 patent to his name.

Career Highlights

Shih-Yung Peng is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in developing advanced packaging techniques that enhance the performance of semiconductor devices.

Collaborations

He has collaborated with notable colleagues, including Po-Hao Tsai and Hsien-Wen Liu, who contribute to the innovative environment at their workplace.

Conclusion

Shih-Yung Peng's contributions to semiconductor packaging through his patent and collaborative efforts highlight his role as an influential inventor in the industry. His work continues to impact the field positively.