Shih-Wen Tang

Title: Shih-Wen Tang: Innovator in Embedded Inductor Technology

Introduction

Shih-Wen Tang is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of embedded inductor technology, holding 2 patents that showcase his innovative approach to electronic packaging.

Latest Patents

His latest patents include a "3D MIS-FO hybrid for embedded inductor package structure." This invention describes an inductor package that comprises a mold interconnection substrate featuring an embedded spiral coil inductor. It also includes a fan-out redistribution layer connected to the spiral coil inductor by a copper post wiring structure, a ferrite toroid coil positioned between the copper posts, and a semiconductor die mounted on the mold interconnection substrate, which is connected to the fan-out redistribution layer. Another notable patent is the "Single side modular 3D stack up SiP with mold cavity." This system in package consists of a first interconnection with redistribution layers, at least one silicon die mounted on its top surface, and solder balls on the bottom surface that provide package output.

Career Highlights

Shih-Wen Tang is currently employed at Dialog Semiconductor (UK) Limited, where he continues to push the boundaries of technology in his field. His work has been instrumental in advancing the capabilities of embedded systems.

Collaborations

He collaborates with talented individuals such as Jesus Mennen Belonio and Che-Han Jerry Li, contributing to a dynamic and innovative work environment.

Conclusion

Shih-Wen Tang's contributions to embedded inductor technology and his innovative patents reflect his expertise and commitment to advancing electronic packaging solutions. His work continues to influence the industry and inspire future innovations.