The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 2025
Filed:
Nov. 30, 2021
Applicant:
Dialog Semiconductor (Uk) Limited, London, GB;
Inventors:
Assignee:
Dialog Semiconductor (UK) Limited, London, GB;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01F 27/02 (2006.01); H01F 27/28 (2006.01); H01F 41/04 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/022 (2013.01); H01F 27/2823 (2013.01); H01F 41/041 (2013.01); H01L 23/3107 (2013.01); H01L 28/10 (2013.01);
Abstract
An inductor package is described comprising a mold interconnection substrate having an embedded spiral coil inductor, a fan-out redistribution layer connected to the spiral coil inductor by a copper post wiring structure, a ferrite toroid coil in between the copper posts, and a semiconductor die mounted on the mold interconnection substrate and connected to the fan-out redistribution layer.