Company Filing History:
Years Active: 2023-2025
Title: Innovations of Jesus Mennen Belonio
Introduction
Jesus Mennen Belonio is a notable inventor based in Germering, Germany. He has made significant contributions to the field of semiconductor packaging, holding 2 patents that showcase his innovative approach to technology.
Latest Patents
Belonio's latest patents include the "3D MIS-FO hybrid for embedded inductor package structure." This invention describes an inductor package that comprises a mold interconnection substrate with an embedded spiral coil inductor. It features a fan-out redistribution layer connected to the spiral coil inductor by a copper post wiring structure, along with a ferrite toroid coil situated between the copper posts. Additionally, a semiconductor die is mounted on the mold interconnection substrate and connected to the fan-out redistribution layer. Another significant patent is the "Single side modular 3D stack up SiP with mold cavity." This system in package includes a first interconnection with redistribution layers, at least one silicon die mounted on its top surface, and passive components embedded in molding compounds, with solder balls providing package output.
Career Highlights
Belonio is currently employed at Dialog Semiconductor (UK) Limited, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing advanced packaging solutions that enhance the performance and efficiency of electronic devices.
Collaborations
Some of his notable coworkers include Shih-Wen Tang and Che-Han Jerry Li, who have collaborated with him on various projects within the semiconductor industry.
Conclusion
Jesus Mennen Belonio's contributions to semiconductor packaging through his innovative patents reflect his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.