Shih-li Chen

Title: Shih-li Chen: Innovator in Wafer Level Packaging Technology

Introduction

Shih-li Chen is a notable inventor based in Jhudong, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in wafer level packaging technology. His innovative approach has led to advancements that enhance the efficiency and effectiveness of manufacturing processes.

Latest Patents

Shih-li Chen holds a patent for a manufacturing tool for wafer level packages and a method of placing dies. This patent describes a method that involves placing a plurality of dice on an elastic material formed on a first base. The elastic material has a specific viscosity that allows it to adhere to the dice. The process includes forming an adhesive material on a second base, adhering the dice to this material, and then stripping the dice from the elastic material under different conditions. This innovative method streamlines the manufacturing process and improves the overall quality of wafer level packages.

Career Highlights

Shih-li Chen is associated with Advanced Chip Engineering Technology, Inc., where he applies his expertise in semiconductor technology. His work has been instrumental in developing new methods that enhance production capabilities and reduce costs in the semiconductor industry. His dedication to innovation has positioned him as a key player in his field.

Collaborations

Shih-li Chen collaborates with talented individuals such as Wen-Kun Yang and Wen-Pin Yang. These partnerships foster a creative environment that encourages the development of cutting-edge technologies in semiconductor manufacturing.

Conclusion

Shih-li Chen's contributions to wafer level packaging technology exemplify the impact of innovation in the semiconductor industry. His patent and collaborative efforts continue to drive advancements that benefit the field.