Shih-Kang Tien

Title: Innovations of Shih-Kang Tien

Introduction

Shih-Kang Tien is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding three patents that showcase his innovative approach to integrated circuit design and manufacturing.

Latest Patents

One of his latest patents focuses on the delamination control of dielectric layers in integrated circuit chips. This patent describes a chip package that includes a substrate with multiple regions, a device layer, a via layer, and an interconnect structure. The design incorporates a stress buffer layer with tapered side profiles, enhancing the reliability of the chip package. Another significant patent involves a semiconductor structure that features a first dielectric layer, conductive vias, and a partial landing pad. This innovative structure aims to improve the electrical connections within semiconductor devices.

Career Highlights

Shih-Kang Tien is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in advancing the technology used in modern electronic devices.

Collaborations

He has collaborated with notable colleagues, including Kai-Yu Cheng and Ching-Kun Huang, who contribute to the innovative environment at their workplace.

Conclusion

Shih-Kang Tien's contributions to semiconductor technology through his patents reflect his expertise and commitment to innovation. His work continues to influence the development of advanced electronic components.