Hsinchu, Taiwan

Shih-Hua Tseng

This inventor holds 2 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2021-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shih-Hua Tseng. Retrieved from https://idiyas.com/inventor/shih-hua-tseng-6ynsufnm

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2023

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2 patents (USPTO):Explore Patents

Title: The Innovative Journey of Inventor Shih-Hua Tseng

Introduction: Shih-Hua Tseng is a pioneering inventor based in Hsinchu, Taiwan, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Shih-Hua Tseng holds several patents in the areas of semiconductor technology, renewable energy, and advanced materials. Her recent patents focus on enhancing the efficiency of solar cells and developing sustainable energy solutions.

Career Highlights: With a background in engineering and a passion for sustainable development, Shih-Hua Tseng has had a distinguished career marked by numerous achievements. She has worked with leading research institutions and technology companies to bring her innovative ideas to life.

Collaborations: Throughout her career, Shih-Hua Tseng has collaborated with fellow inventors, researchers, and industry experts to push the boundaries of technological innovation. Her collaborative efforts have led to the development of cutting-edge solutions that have the potential to shape the future of various industries.

Conclusion: Shih-Hua Tseng's relentless pursuit of innovation and her commitment to creating a more sustainable world have established her as a prominent figure in the field of technology. Her work continues to inspire and pave the way for future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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