Shigetaka Onishi

Title: Shigetaka Onishi: Innovator in Semiconductor Manufacturing

Introduction

Shigetaka Onishi is a prominent inventor based in Yokkaichi, Japan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 2 patents. His innovative approaches have paved the way for advancements in the efficiency and effectiveness of semiconductor devices.

Latest Patents

Onishi's latest patents focus on a manufacturing method for semiconductor devices. This method involves laminating an adhesive layer, with a thickness exceeding 25 μm, and a dicing tape on the rear surface of a semiconductor wafer. The process includes cutting the semiconductor wafer along with a portion of the adhesive layer using a first blade, which reaches the adhesive layer's depth. Subsequently, a second blade, narrower than the first, is used to cut through the adhesive layer and the dicing tape. The semiconductor element, sectioned by this cutting process, is then picked up from the dicing tape and adhered to another semiconductor element or a circuit board.

Career Highlights

Shigetaka Onishi is associated with Kabushiki Kaisha Toshiba, a leading company in the technology sector. His work has been instrumental in enhancing the manufacturing processes of semiconductor devices, contributing to the company's reputation for innovation and quality.

Collaborations

Onishi has collaborated with notable coworkers, including Atsushi Yoshimura and Tadanobu Okubo. Their combined expertise has fostered a productive environment for innovation within the company.

Conclusion

Shigetaka Onishi's contributions to semiconductor manufacturing exemplify the spirit of innovation in technology. His patents reflect a commitment to advancing the field and improving manufacturing processes.