Kabushiki Kaisha Toshiba

Shigetaka Onishi

Atsushi Yoshimura

Tadanobu Okubo

An adhesive layer of which thickness is over 25 &#x3bc;m and a dicing tape are laminated on a rear surface of a semiconductor wafer. The semiconductor wafer is cut together with a part of the adhesive layer by using a first blade of which cutting depth reaches the adhesive layer. The adhesive layer is cut together with a part of the dicing tape by using a second blade of which cutting depth reaches the dicing tape and of which width is narrower than the first blade. A semiconductor element sectioned by cutting the semiconductor wafer with the adhesive layer is picked up from the dicing tape, and is adhered on another semiconductor element or a circuit board.

Growing community of inventors

Yokkaichi, Japan

Shigetaka Onishi