Shigeo Nishino

Title: Shigeo Nishino: Innovator in Multilayer Wiring Board Technology

Introduction

Shigeo Nishino is a notable inventor based in Hitachi, Japan. He has made significant contributions to the field of electrical engineering, particularly in the development of multilayer wiring boards. His innovative approach has led to advancements that enhance the performance and reliability of electronic devices.

Latest Patents

Nishino holds a patent for a multilayer wiring board and the method of making the same. This invention features a core insulating layer with a first conductive wiring, a first insulating layer with a softening temperature lower than the core insulating layer, and a second insulating layer formed on the core insulating layer through the first insulating layer. The second insulating layer includes a second conductive wiring that is electrically connected to the first conductive wiring, with a softening temperature higher than that of the first insulating layer. The first insulating layer is primarily composed of a liquid crystal polymer, while the core insulating layer and the second insulating layer are mainly made of polyimide resin or bismaleimide triazine resin. The first and second conductive wirings are interconnected through a conductive via that penetrates the first and second insulating layers in the thickness direction. Nishino's patent portfolio includes 1 patent.

Career Highlights

Shigeo Nishino is associated with Hitachi Cable, Inc., where he has been instrumental in advancing wiring technologies. His work has contributed to the development of high-performance electronic components that are essential in modern technology.

Collaborations

Nishino has collaborated with notable colleagues, including Hiroyuki Okabe and Hiroyuki Takasaka. These partnerships have fostered innovation and have played a crucial role in the success of their projects.

Conclusion

Shigeo Nishino's contributions to multilayer wiring board technology exemplify his commitment to innovation in the field of electrical engineering. His patent and collaborations highlight the importance of teamwork in driving technological advancements.