The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 15, 2012
Filed:
Jun. 13, 2008
Shigeo Nishino, Hitachi, JP;
Hiroyuki Takasaka, Hitachi, JP;
Nagayoshi Matsuo, Hitachi, JP;
Hiroyuki Okabe, Hitachi, JP;
Shigeo Nishino, Hitachi, JP;
Hiroyuki Takasaka, Hitachi, JP;
Nagayoshi Matsuo, Hitachi, JP;
Hiroyuki Okabe, Hitachi, JP;
Hitachi Cable, Ltd., Tokyo, JP;
Abstract
A multilayer wiring board includes a core insulating layer with a first conductive wiring, a first insulating layer with a softening temperature lower than the core insulating layer, and a second insulating layer formed on the core insulating layer through the first insulating layer, the second insulating layer with a second conductive wiring electrically connected to the first conductive wiring and a softening temperature higher than the first insulating layer. The first insulating layer is mainly formed of a liquid crystal polymer. The core insulating layer and the second insulating layer are mainly formed of a polyimide resin or a bismaleimide triazine resin. The first conductive wiring and the second conductive wiring are electrically connected through a conductive via formed penetrating through the first insulating layer and the second insulating layer in a thickness direction.