Company Filing History:
Years Active: 2012
Title: Hiroyuki Okabe: Innovator in Multilayer Wiring Board Technology
Introduction
Hiroyuki Okabe is a notable inventor based in Hitachi, Japan. He has made significant contributions to the field of electrical engineering, particularly in the development of multilayer wiring boards. His innovative approach has led to the creation of a patented technology that enhances the performance and reliability of electronic devices.
Latest Patents
Hiroyuki Okabe holds a patent for a multilayer wiring board and the method of making the same. This invention features a core insulating layer with a first conductive wiring, a first insulating layer with a softening temperature lower than the core insulating layer, and a second insulating layer formed on the core insulating layer through the first insulating layer. The second insulating layer includes a second conductive wiring that is electrically connected to the first conductive wiring and has a softening temperature higher than the first insulating layer. The first insulating layer is primarily composed of a liquid crystal polymer, while the core insulating layer and the second insulating layer are mainly made of a polyimide resin or a bismaleimide triazine resin. The first and second conductive wirings are electrically connected through a conductive via that penetrates through the first insulating layer and the second insulating layer in a thickness direction. This innovative design improves the efficiency and functionality of multilayer wiring boards.
Career Highlights
Hiroyuki Okabe is associated with Hitachi Cable, Inc., where he has been instrumental in advancing wiring board technology. His work has not only contributed to the company's reputation but has also set new standards in the industry. With a focus on innovation, Okabe continues to push the boundaries of what is possible in electrical engineering.
Collaborations
Throughout his career, Hiroyuki Okabe has collaborated with esteemed colleagues such as Shigeo Nishino and Hiroyuki Takasaka. These partnerships have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.
Conclusion
Hiroyuki Okabe's contributions to the field of multilayer wiring boards exemplify the spirit of innovation. His patented technology represents a significant advancement in electrical engineering, showcasing his dedication to improving electronic device performance. His work continues to inspire future innovations in the industry.