Company Filing History:
1 out of 1,099 
1 out of 2 Years Active: 2010
Title: Shigenao Ito: Innovator in Wafer Polishing Technology
Introduction
Shigenao Ito is a notable inventor based in Yamatokohriyama, Japan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of wafer polishing. His innovative approach has led to the development of a unique method and pad for polishing wafers, which enhances the efficiency and effectiveness of the process.
Latest Patents
Shigenao Ito holds 1 patent for his invention titled "Method and pad for polishing wafer." This patent describes a method that effectively prevents sagging in the outer peripheral portion of a wafer during the polishing process. The method involves mirror-polishing a wafer with a polishing pad made of non-woven fabric impregnated with resin. A key aspect of this invention is the specific ratio of surface roughness to compressibility of the polishing pad, which is set at 3.8 or more.
Career Highlights
Throughout his career, Shigenao Ito has worked with prominent companies in the semiconductor industry. He has been associated with Shin-Etsu Handotai Co., Ltd., a leading manufacturer of silicon products, and Rodel Nitta Company, known for its advanced polishing solutions. His work in these organizations has contributed to advancements in wafer processing technologies.
Collaborations
Shigenao Ito has collaborated with several talented individuals in his field. Notable coworkers include Hisashi Masumura and Kazuya Tomii, who have worked alongside him in various projects related to wafer polishing and semiconductor manufacturing.
Conclusion
Shigenao Ito's contributions to wafer polishing technology have made a significant impact on the semiconductor industry. His innovative methods and collaborative efforts continue to influence advancements in this critical field.