The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 13, 2010
Filed:
Oct. 25, 2002
Hisashi Masumura, Fukushima, JP;
Kazuya Tomii, Tokyo, JP;
Shigenao Ito, Yamatokohriyama, JP;
Kenichi Anzai, Yamatokohriyama, JP;
Kenichi Inoue, Yamatokohriyama, JP;
Hisashi Masumura, Fukushima, JP;
Kazuya Tomii, Tokyo, JP;
Shigenao Ito, Yamatokohriyama, JP;
Kenichi Anzai, Yamatokohriyama, JP;
Kenichi Inoue, Yamatokohriyama, JP;
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Rodel Nitta Company, Osaka, JP;
Abstract
A method for polishing a wafer effectively preventing a sag in an outer peripheral portion of a wafer and a polishing pad for polishing a wafer preferably used in the method for polishing a wafer are provided. The method for polishing a wafer comprises the step of: mirror-polishing a wafer with a main surface of the wafer being in contact with a polishing pad of non-woven fabric impregnated with resin, wherein a ratio of surface roughness of the polishing pad to compressibility thereof {surface roughness Ra (μm)/compressibility (%)} is 3.8 or more.