Shigemitsu Kawagishi

Title: Shigemitsu Kawagishi: Innovator in Electroless Plating Technologies

Introduction

Shigemitsu Kawagishi is a notable inventor based in Suita, Japan. He has made significant contributions to the field of electroless plating, holding a total of six patents. His work has advanced the techniques and compositions used in this specialized area of materials science.

Latest Patents

Kawagishi's latest patents include a process for electroless gold plating and an electroless palladium plating composition. The process for electroless gold plating involves a plating solution that includes cyanoaurate, alkaline cyanide, a reducing agent, alkaline hydroxide, a crystal condition controlling agent, and a stabilizer. Notably, an aldehyde or a ketone compound is added along with replenished gold salt, and hydrogen peroxide may also be included if necessary. The electroless palladium plating composition consists of a palladium compound, a hypophosphite compound, ammonia or alkylamine compounds, high-molecular weight polyethyleneimine, and an aliphatic alkyenylamine, all used at a pH range of 5-10.

Career Highlights

Throughout his career, Kawagishi has worked with reputable companies such as Okuno Chemical Industry Co., Ltd. and Okuno Chemical Industries Co., Ltd. His experience in these organizations has allowed him to refine his expertise in plating technologies and contribute to innovative solutions in the industry.

Collaborations

Kawagishi has collaborated with notable individuals in his field, including Eiichi Torikai and Kazuyoshi Okuno. These partnerships have fostered a collaborative environment that has led to advancements in electroless plating techniques.

Conclusion

Shigemitsu Kawagishi's contributions to electroless plating technologies have made a significant impact in the field. His innovative patents and collaborations highlight his dedication to advancing materials science. His work continues to influence the industry and inspire future innovations.