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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5292361 B1

PDFFull Text
Date of Patent:
Mar. 08, 1994

Filed:

Jul. 30, 1992

Electroless palladium plating composition

Applicant:
Inventors:

Kuniaki Otsuka, Osaka, JP;

Eiichi Torikai, Yao, JP;

Shigemitsu Kawagishi, Suita, JP;

Kazuyoshi Okuno, Ashiya, JP;

Assignee:

Okuno Chemical Industries Co., Ltd., Osaka, JP;

Attorney:

Knobbe Martens Olson & Bear

Primary Examiner:

Helene Klemanski

Assistant Examiner:

Margaret Einsmann

Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
106-128 ; 106-105 ;
Abstract

An electroless palladium plating composition which comprises (1) 0.001-0.1 mol/l of a palladium compound, (2) 0.01-1 mol/l of a hypophosphite compound, (3) 0.01-5 mol/l of at least one member selected from the group consisting of ammonia and alkylamine compounds, (4) 0.01-20 mg/l of high-molecular weight polyethyleneimine having molecular weight of 300 to 100000 and (5) 0.01-10 g/l of an aliphatic alkyenylamine, and which is used at a pH in the range of 5-10.

Find Patent Forward Citations

Otsuka, Kuniaki. (1994). Electroless palladium plating composition (U.S. Patent No. 5292361). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5292361

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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