Kasukabe, Japan

Shigeki Kudo

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignees: Dsm IP Assets B.v., Toppan Printing Co., Ltd.. Active years: 2016-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shigeki Kudo. Retrieved from https://idiyas.com/inventor/shigeki-kudo-lf92u3fb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 3 

% Patents Active = 33.3

Average Co-Inventor Count = 4.6

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • Kasukabe, JP (2016 - 2020)
  • Tokyo, JP (2021)

Company Filing History:


Years Active: 2016-2021

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3 patents (USPTO):Explore Patents

Title: Shigeki Kudo: Innovator in Packaging and Circuit Board Manufacturing

Introduction

Shigeki Kudo is a notable inventor based in Kasukabe, Japan. He has made significant contributions to the fields of packaging and circuit board manufacturing. With a total of 3 patents to his name, Kudo's work showcases his innovative approach to solving complex engineering challenges.

Latest Patents

Kudo's latest patents include advancements in packaging technology. One of his notable inventions is a packaging system that features a base layer made of a biaxially oriented resin film. This system includes a sealant layer composed of two thermoplastic resin layers, which are laminated in a specific order to enhance performance. The first resin layer has a higher density than the second, ensuring optimal functionality. Additionally, the second thermoplastic resin layer incorporates a lubricant to improve its properties.

Another significant patent involves a method for manufacturing circuit boards. This method entails forming metal electrodes on a holding sheet by cutting a metal foil. The process includes creating adhesive layers on the electrodes and adhering them to a base material, allowing for efficient production of circuit boards.

Career Highlights

Throughout his career, Kudo has worked with prominent companies such as DSM IP Assets B.V. and Toppan Printing Co., Ltd. His experience in these organizations has contributed to his expertise in developing innovative solutions in packaging and electronics.

Collaborations

Kudo has collaborated with talented individuals in his field, including Minoru Kawasaki and Koichi Kumai. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Shigeki Kudo's contributions to packaging and circuit board manufacturing highlight his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving product functionality and efficiency. Kudo's work continues to influence the industry and inspire future innovations.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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