Dsm IP Assets B.v.

Toppan Printing Co., Ltd.

Shigeki Kudo

Minoru Kawasaki

Koichi Kumai

Ryuji Ueda

Kentaro Kubota

Nobuhiko Imai

Osamu Takemoto

A packaging is provided including: a base layer including at least one layer of a biaxially oriented resin film; and a sealant layer including at least a first thermoplastic resin layer and a second thermoplastic resin layer, in which the base layer, the first thermoplastic resin laser, and the second thermoplastic resin layer are laminated in this order, a density of a first resin forming the first thermoplastic resin layer is higher than a density of a second resin forming the second thermoplastic resin layer, the density of the first resin is 0.90 g/cmor higher, the density of the second resin is 0.92 g/cmor lower, and the second thermoplastic resin layer contains 200 to 2000 ppm of a lubricant including at least one of a fatly acid amide lubricant and a fatty acid ester lubricant.

Packaging, barrier packaging material, and packaging bag

A method of manufacturing a circuit board includes: forming a plurality of metal electrodes so as to be separated from each other on a holding sheet by cutting a metal foil held on the holding sheet to remove a portion of the metal foil; forming adhesive layers on surfaces of the plurality of metal electrodes; adhering the adhesive layers to a base material by closely contacting the adhesive layers with the base material; and transcribing the adhesive layers and the plurality of metal electrodes onto the base material by detaching the holding sheet from the plurality of metal electrodes.

Method of manufacturing a circuit board by punching

Growing community of inventors

Kasukabe, Japan

Shigeki Kudo