Shi Hou Chong

Title: Innovations of Shi Hou Chong in Die Testing Technology

Introduction: Shi Hou Chong is a notable inventor based in Penang, Malaysia. He has made significant contributions to the field of integrated circuit (IC) testing. His innovative approach has led to the development of a unique patent that enhances die testing methodologies.

Latest Patents: Shi Hou Chong holds a patent titled "Die stack override for die testing." This patent discloses structures and techniques for exposing circuitry during die testing. In some embodiments, the integrated circuit die includes first conductive contacts at a first face and second conductive contacts at a second face. The design incorporates die stack emulation circuitry and a switch that connects the second conductive contacts to other circuitry based on its state. This innovation aims to improve the efficiency and accuracy of die testing processes.

Career Highlights: Shi Hou Chong is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has allowed him to contribute to cutting-edge technologies in the electronics industry.

Collaborations: Shi Hou Chong has collaborated with talented colleagues, including Terrence Huat Hin Tan and Rehan M Sheikh. Their combined expertise fosters a creative environment that drives innovation in their projects.

Conclusion: Shi Hou Chong's contributions to die testing technology exemplify the importance of innovation in the semiconductor industry. His patent reflects a commitment to enhancing testing methodologies, which is crucial for the advancement of integrated circuits.