San Diego, CA, United States of America

Sherief Helwa

This inventor holds 1 USPTO granted patent and 53 published patent applications. Top assignee: Qualcomm Incorporated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sherief Helwa. Retrieved from https://idiyas.com/inventor/sherief-helwa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

Loading Chart...
1 patent (USPTO):Explore Patents

Title: Sherief Helwa: Innovator in Overlapping Physical Layer Protocols

Introduction

Sherief Helwa is a notable inventor based in San Diego, California. He has made significant contributions to the field of telecommunications, particularly in the development of protocols that enhance data transmission efficiency. His innovative work has led to the granting of a patent, showcasing his expertise and dedication to advancing technology.

Latest Patents

Sherief Helwa holds a patent titled "Overlapping Physical Layer Protocol Data Unit End Point Offset." This patent addresses critical aspects of data unit management in communication systems, reflecting his commitment to improving network performance. He has 1 patent to his name, which underscores his role as a key contributor to technological advancements.

Career Highlights

Helwa is currently employed at Qualcomm Incorporated, a leading company in wireless technology and telecommunications. His work at Qualcomm has allowed him to collaborate with some of the brightest minds in the industry, further enhancing his skills and knowledge in the field.

Collaborations

Throughout his career, Sherief has worked alongside talented colleagues, including George Cherian and Abhishek Pramod Patil. These collaborations have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies.

Conclusion

Sherief Helwa is a distinguished inventor whose work in overlapping physical layer protocols has made a significant impact on telecommunications. His contributions, particularly through his patent and collaborations at Qualcomm, highlight his role as a leader in innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…