The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2026

Filed:

Mar. 11, 2024
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Sherief Helwa, San Diego, CA (US);

George Cherian, San Diego, CA (US);

Abhishek Pramod Patil, San Diego, CA (US);

Gaurang Naik, San Diego, CA (US);

Alfred Asterjadhi, San Diego, CA (US);

Sanket Sanjay Kalamkar, San Diego, CA (US);

Sai Yiu Duncan Ho, San Diego, CA (US);

Giovanni Chisci, San Diego, CA (US);

Abhi Shivamurthy, San Diego, CA (US);

Sanket Gupta, San Diego, CA (US);

Assignee:

QUALCOMM INCORPORATED, SAN DIEGO, CA (US);

Primary Examiner:
Int. Cl.
CPC ...
U.S. Cl.
CPC ...
H04L 1/1887 ; H04W 52/0216 ; H04W 84/12 ;

Find Patent Forward Citations

Helwa, Sherief. (2026). Overlapping physical layer protocol data unit end point offset (U.S. Patent No. 12713345). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12713345

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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