Shenglin Ma

Title: Innovations of Shenglin Ma in Three-Dimensional Structures

Introduction

Shenglin Ma is a prominent inventor based in Beijing, China. He has made significant contributions to the field of three-dimensional vertically interconnected structures. With a total of 2 patents, his work focuses on enhancing electric interconnections and simplifying fabrication methods.

Latest Patents

Shenglin Ma's latest patents include innovative designs for three-dimensional vertically interconnected structures. The first patent discloses a structure comprising at least two layers of chips stacked in sequence or face to face. An adhesive material is utilized for adhesion between adjacent layers, with each layer containing a substrate layer and a dielectric layer. The front surface of the chip features a first concave filled with metal, forming an electrical conductive ring that connects to microelectronic devices via a redistribution layer. This invention enhances electric interconnection and bonding between layers while simplifying the fabrication process.

The second patent also focuses on a three-dimensional vertically interconnected structure, detailing similar features as the first. It emphasizes the strength of electric interconnections and adhesion between layers, while the disclosed fabrication method improves yield and reduces process difficulty.

Career Highlights

Shenglin Ma is affiliated with Peking University, where he continues to advance his research and innovations. His work has garnered attention for its practical applications in microelectronics and semiconductor technology.

Collaborations

Shenglin Ma collaborates with notable colleagues, including Min Miao and Yunhui Zhu. Their combined expertise contributes to the development of cutting-edge technologies in their field.

Conclusion

Shenglin Ma's contributions to three-dimensional vertically interconnected structures represent a significant advancement in microelectronics. His innovative patents and collaborations highlight the importance of research in enhancing technology and improving fabrication methods.