Sheng-Yuan Chou

Title: Innovations of Sheng-Yuan Chou

Introduction

Sheng-Yuan Chou is a notable inventor based in Milpitas, CA (US). He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique wafer-bonding structure.

Latest Patents

Sheng-Yuan Chou holds 1 patent for his invention titled "Wafer-bonding structure and method of forming thereof." This patent describes a method that includes a wafer-bonding step, a through silicon via (TSV) forming step, and a forming bonding pad step. In the wafer-bonding step, at least two wafers are bonded to each other by their bonding surfaces. The TSV forming step involves creating a TSV structure on one side of a seal ring structure of one of the wafers, where a conductive filler is placed in the TSV structure. This structure overlaps with the seal ring structure of another wafer. Finally, in the forming bonding pad step, a bonding pad is created on the outer surface relative to the bonding surface of the wafer with the TSV structure, resulting in the complete wafer-bonding structure.

Career Highlights

Sheng-Yuan Chou is currently employed at Integrated Silicon Solution Incorporated. His work at this company has been instrumental in advancing semiconductor technologies. His expertise in wafer bonding and TSV technology has positioned him as a key figure in his field.

Collaborations

Sheng-Yuan Chou has collaborated with notable colleagues, including Hsingya Arthur Wang and Yu-Ting Wang. Their teamwork has contributed to the success of various projects within their organization.

Conclusion

Sheng-Yuan Chou's innovative contributions to wafer-bonding technology highlight his importance in the semiconductor industry. His patent and collaborative efforts reflect his commitment to advancing technology in this field.