This inventor holds 1 USPTO granted patent. Top assignee: Unimicron Technology Corporation. Active years: 2016.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2016
Title: Innovations of Sheng-Yuah He in Coreless Packaging Substrates.
Introduction
Sheng-Yuah He is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of packaging technology, particularly in the development of coreless packaging substrates. His innovative approach has led to advancements that enhance product yield and reduce fabrication costs.
Latest Patents
Sheng-Yuah He holds a patent for a "Carrier and method for fabricating coreless packaging substrate." This patent outlines a fabrication method that includes forming an inner built-up circuit board on a carrier, removing the carrier, and symmetrically forming a first outer built-up structure and a second outer built-up structure on the top and bottom surfaces of the inner built-up circuit board, respectively. This invention effectively increases product yield, saves fabrication costs, and reduces waste.
Career Highlights
He is currently employed at Unimicron Technology Corporation, where he continues to innovate in the field of packaging technology. His work has been instrumental in advancing the capabilities of coreless packaging substrates.
Collaborations
Sheng-Yuah He has collaborated with notable colleagues, including Tzyy-Jang Tseng and Chung W Ho, to further enhance the development of innovative packaging solutions.
Conclusion
Sheng-Yuah He is a prominent figure in the field of packaging technology, with a focus on coreless substrates. His contributions have led to significant advancements that benefit the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile