Kaohsiung, Taiwan

Sheng-Tung Tsai

This inventor holds 1 USPTO granted patent. Top assignee: Walsin Advanced Electronics Ltd.. Active years: 2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sheng-Tung Tsai. Retrieved from https://idiyas.com/inventor/sheng-tung-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2001

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1 patent (USPTO):Explore Patents

Title: The Innovations of Sheng-Tung Tsai

Introduction

Sheng-Tung Tsai is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique lead frame structure that enhances semiconductor packaging.

Latest Patents

Sheng-Tung Tsai holds 1 patent for his invention titled "Lead frame structure." This patent describes a lead frame designed for a semiconductor package. The lead frame features a die pad that supports a silicon chip on one surface, while the other surface contains a series of annular grooves, all sharing the same geometric center. The inner lead portion of the leads surrounds the die pad, with the die pad and the leads positioned on different planar surfaces.

Career Highlights

Tsai is currently employed at Walsin Advanced Electronics Ltd., where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the technology used in electronic devices.

Collaborations

Some of his coworkers include Wen-Chun Liu and Hui-Ping Liu, who contribute to the collaborative environment at Walsin Advanced Electronics Ltd.

Conclusion

Sheng-Tung Tsai's contributions to semiconductor technology through his innovative lead frame structure exemplify the importance of creativity in engineering. His work continues to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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