This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations of Sheng-Po Tseng in Integrated Circuit Technology
Introduction
Sheng-Po Tseng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit technology. His innovative work has led to the development of a unique vacuum tip assembly that enhances the efficiency of pick-and-place tools.
Latest Patents
Sheng-Po Tseng holds 1 patent for his invention titled "Vacuum tip assembly for use in pick-and-place tool." This patent describes an improved vacuum tip designed to facilitate the attachment and detachment of integrated circuit dies without causing deformation. The vacuum tip features a body with a top and bottom surface, incorporating grooves that extend radially from a central point. Additionally, it includes a channel that runs through the body, ensuring efficient transport of integrated circuit dies.
Career Highlights
Sheng-Po Tseng is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work at this prestigious company has allowed him to contribute to advancements in semiconductor manufacturing processes.
Collaborations
Sheng-Po Tseng has collaborated with Ching Hsien Liu, further enhancing the innovative capabilities within their field. Their partnership exemplifies the collaborative spirit that drives technological advancements in the semiconductor industry.
Conclusion
Sheng-Po Tseng's contributions to integrated circuit technology through his innovative vacuum tip assembly demonstrate his commitment to improving manufacturing processes. His work continues to influence the semiconductor industry positively.