Sheng-Liang Dai

Title: Innovations of Sheng-Liang Dai

Introduction

Sheng-Liang Dai is a notable inventor based in Kunshan, China. He has made significant contributions to the field of electronic devices and heat dissipation technologies. With a total of seven patents to his name, Dai's work showcases his expertise and innovative spirit.

Latest Patents

One of his latest patents is for an electronic device that includes an electronic component and a heat dissipating casing designed to effectively manage heat. This casing features top and bottom sides that form a sealed chamber, along with a pore structure within the chamber. The sealed chamber is intended to receive a working medium, while the pore structure absorbs a portion of this medium, allowing heat generated by the electronic component to be dissipated through a phase change of the working medium. Another significant patent involves a method for manufacturing a heat pipe. This method includes several steps, such as providing a tube and a rod, inserting the rod into the tube, and creating a receiving portion. Metal powder is then filled into this portion and sintered at high temperatures to form a wick structure, followed by injecting a working medium and sealing the tube to complete the heat pipe.

Career Highlights

Dai has worked with prominent companies, including Furui Precise Component Co., Ltd. and Foxconn Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Some of his notable coworkers include Jin-Peng Liu and Yue Liu. Their collaboration has likely fostered a creative environment that encourages innovation and the development of new technologies.

Conclusion

Sheng-Liang Dai's contributions to the field of electronic devices and heat dissipation are noteworthy. His patents reflect a deep understanding of technology and a commitment to innovation. Through his work, he continues to influence the industry and inspire future inventors.