This inventor holds 1 USPTO granted patent. Top assignee: City University of Hong Kong. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Sheng-Jye Cherng and Advances in Copper Interconnect Packaging.
Introduction
Sheng-Jye Cherng is an inventor associated with City University of Hong Kong. His work includes a patent addressing copper structures for advanced integrated-circuit packaging.
Latest Patents
Cherng is named on one patent: “IC Package with Nanotwinning-Assisted Structurally Stable Copper Structure.” The invention combines fine copper grains with nanotwins to improve structural stability and resist surface damage over time. It is intended to support finer redistribution layers in advanced packaging and to provide a longer electromigration lifetime than conventional coarse-grain copper lines. The supplied information lists 1 patent.
Career Highlights
The patent reflects research into materials and interconnect reliability for advanced packaging technologies. Cherng’s listed institutional affiliation is City University of Hong Kong.
Collaborations
The supplied information identifies Shien-Ping Feng and Chih-Chun Chung as Cherng’s coworkers.
Conclusion
Sheng-Jye Cherng’s patent explores how nanotwinning-assisted copper structures may improve the stability and reliability of finer interconnects in advanced packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile