The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Feb. 07, 2024
City University of Hong Kong, Hong Kong, HK;
Shien-Ping Feng, Hong Kong, HK;
Chih-Chun Chung, Hong Kong, HK;
Sheng-Jye Cherng, Hong Kong, HK;
Kaiyu Mu, Hong Kong, HK;
City University of Hong Kong, Hong Kong, HK;
Abstract
The present invention introduces a composite copper (Cu) structure that combines fine grains and nanotwins, providing structural stability and effective resistance to surface damage even after extended periods. This offers a promising solution for achieving finer Redistribution Layer (RDL) in advanced packaging technologies, with a longer electromigration lifetime compared to regular coarse-grain lines.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile