Company Filing History:
Years Active: 2015
Title: The Innovations of Sheng-Jian Jou
Introduction
Sheng-Jian Jou is a notable inventor based in Huwei, Taiwan. He has made significant contributions to the field of semiconductor technology. His work focuses on innovative packaging solutions that enhance the performance and functionality of semiconductor devices.
Latest Patents
Sheng-Jian Jou holds a patent for a "Semiconductor package having an antenna and manufacturing method thereof." This invention includes a semiconductor package that comprises a first substrate, a second substrate, an interposer substrate, a semiconductor chip, a package body, and a first antenna layer. The first substrate features a grounding segment, while the interposer substrate is positioned between the second substrate and the first substrate. The semiconductor chip is mounted on the second substrate, and the package body encapsulates the second substrate, the semiconductor chip, and the interposer substrate. Notably, the first antenna layer is formed on both the lateral surface and the upper surface of the package body, establishing an electrical connection to the grounding segment. This innovative design enhances the functionality of semiconductor packages.
Career Highlights
Sheng-Jian Jou is associated with Advanced Semiconductor Engineering, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise and innovative approach have positioned him as a key figure in the industry.
Collaborations
Throughout his career, Sheng-Jian Jou has collaborated with talented individuals such as I-Chia Lin and Han-Chee Yen. These collaborations have contributed to the advancement of semiconductor technologies and have fostered a culture of innovation within his team.
Conclusion
Sheng-Jian Jou's contributions to semiconductor technology, particularly through his patented innovations, highlight his role as a leading inventor in the field. His work continues to influence the development of advanced semiconductor packaging solutions.