Sheng-Hsiung Ho

Title: Innovations of Sheng-Hsiung Ho

Introduction

Sheng-Hsiung Ho is a notable inventor based in Hsinchu Hsien, Taiwan. He has made significant contributions to the field of flexible printed circuit boards, holding a total of 2 patents. His work focuses on enhancing the functionality and reliability of electronic devices.

Latest Patents

One of his latest patents is titled "Reel-type package of flexible printed circuit boards and method for supplying thereof." This invention discloses a method for reel-type packaging of flexible printed circuit boards (FPCs). The process involves cutting a flexible plate with multiple FPC patterns into bar-like materials, which are then wound onto a reel. This innovative packaging method prevents the FPCs from crumpling, curving, and deforming under external forces. Another significant patent is the "Anisotropic conductive film bonding pad." This invention features enhanced ACF bonding pads designed for use in electronic devices, such as liquid crystal display panels and plasma display panels. The bonding pads have at least two finger-like portions, which improve electrical contact with other metal structures by allowing the ACF film's binder material to reside between the finger-like portions.

Career Highlights

Sheng-Hsiung Ho is currently associated with AU Optronics Corporation, where he continues to innovate in the field of electronics. His work has contributed to advancements in the manufacturing and functionality of electronic components.

Collaborations

He has collaborated with notable coworkers, including Chuan-Mao Wei and Ke-Feng Lin, who have also contributed to the field of flexible electronics.

Conclusion

Sheng-Hsiung Ho's contributions to the field of flexible printed circuit boards and his innovative patents demonstrate his commitment to advancing technology in electronics. His work continues to impact the industry positively.