The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 02, 2006
Filed:
Feb. 26, 2004
Sheng-hsiung Ho, Jhudong Township, Hsinchu County, TW;
Chuan-mao Wei, Jhudong Township, Hsinchu County, TW;
Ke-feng Lin, Taipei, TW;
Sheng-Hsiung Ho, Jhudong Township, Hsinchu County, TW;
Chuan-Mao Wei, Jhudong Township, Hsinchu County, TW;
Ke-Feng Lin, Taipei, TW;
AU Optronics Corp., , TW;
Abstract
Enhanced ACF bonding pads for use in conjunction with anisotropic conductive film (ACF) in electronic devices, such as, liquid crystal display panels and plasma display panels have at least two finger-like portions. Such bonding pads, typically provided on a flexible wiring lead, when bonded to other metal structures via the ACF film, make better electrical contact with the other metal structures because the spaces between the finger-like portions of the improved bonding pads allow the ACF film's binder material to reside between the finger-like portions preventing the bonding pad metal in the center region of the bonding pad from separating away from the other metal structures.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile