Kunshan, China

Sheng-Guo Zhou


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2013-2016

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3 patents (USPTO):Explore Patents

Title: Innovations of Sheng-Guo Zhou

Introduction

Sheng-Guo Zhou is a notable inventor based in Kunshan, China. He has made significant contributions to the field of thermal management through his innovative designs. With a total of three patents to his name, Zhou has demonstrated a commitment to advancing technology in heat transfer solutions.

Latest Patents

Zhou's latest patents include a groundbreaking design for a flat heat pipe. This exemplary flat heat pipe features a hollow, flattened casing that houses both a first wick structure and a second wick structure. The casing is composed of a top plate and a bottom plate, which are opposite each other. The first wick structure is crafted by weaving wires, while the second wick structure is made from sintered metal powder. These wick structures are strategically placed on the inner sides of the bottom and top plates, ensuring they make contact with each other. Additionally, the casing is designed with two vapor channels located at opposite lateral sides of the combined wick structures.

Career Highlights

Throughout his career, Sheng-Guo Zhou has worked with prominent companies such as Furui Precise Component Co., Ltd. and Foxconn Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Zhou has collaborated with talented individuals in his field, including Sheng-Liang Dai and Jin-Peng Liu. These partnerships have fostered a creative environment that encourages the exchange of ideas and advancements in technology.

Conclusion

Sheng-Guo Zhou's contributions to the field of thermal management through his patents and collaborations highlight his innovative spirit and dedication to improving technology. His work continues to influence the industry and inspire future inventors.

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