This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Shenavia Howell: Innovator in Integrated Circuit Packaging
Introduction
Shenavia Howell is a notable inventor based in Chandler, AZ (US). He has made significant contributions to the field of integrated circuit packaging, showcasing his expertise through innovative designs and technologies. His work is particularly recognized for enhancing the performance and efficiency of electronic devices.
Latest Patents
Shenavia Howell holds a patent for a groundbreaking invention titled "Chip-scale package architectures containing a die back side metal and a solder thermal interface material." This integrated circuit (IC) package features a die with a front side and a back side. The design incorporates a solder thermal interface material (STIM) with a thermal conductivity of not less than 40 W/mK, placed over the backside of the die. Additionally, a die backside material (DBM) is utilized, which has a coefficient of thermal expansion (CTE) of not less than 18×10m/mK. The interface between the STIM and the DBM includes at least one intermetallic compound (IMC) formed from the first and second metals, enhancing the thermal performance of the package.
Career Highlights
Shenavia Howell is currently employed at Intel Corporation, where he continues to push the boundaries of technology in the semiconductor industry. His work at Intel has allowed him to collaborate with some of the brightest minds in the field, contributing to advancements that impact a wide range of electronic applications.
Collaborations
Some of his notable coworkers include Susmriti Das Mahapatra and Malavarayan Sankarasubramanian. Their collaborative efforts have fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies in integrated circuit packaging.
Conclusion
Shenavia Howell's contributions to the field of integrated circuit packaging exemplify his dedication to innovation and excellence. His patent and work at Intel Corporation highlight his role as a key player in advancing technology.