Shawna M Lift

Title: Shawna M Lift: Innovator in Microelectronic Assemblies

Introduction

Shawna M Lift is a prominent inventor based in Scottsdale, AZ (US). She has made significant contributions to the field of microelectronics, holding a total of 4 patents. Her work focuses on innovative techniques and mechanisms that enhance the performance and efficiency of microelectronic assemblies.

Latest Patents

Among her latest patents is the "Sacrificial redistribution layer in microelectronic assemblies having direct bonding." This patent describes a microelectronic assembly that includes a first microelectronic component with a direct bonding region, featuring metal contacts and dielectric materials. The assembly is designed to improve the coupling between microelectronic components through interconnects, optimizing performance. Another notable patent is the "Composite interposer structure and method of providing same," which outlines techniques for high interconnect density communication with an interposer. This invention includes a substrate with portions that adjoin at a material interface, enhancing the interconnectivity of hardware interfaces.

Career Highlights

Shawna M Lift is currently employed at Intel Corporation, where she continues to push the boundaries of microelectronic technology. Her innovative work has positioned her as a key player in the industry, contributing to advancements that are critical for modern electronic devices.

Collaborations

Throughout her career, Shawna has collaborated with talented individuals such as Adel A Elsherbini and Johanna M Swan. These collaborations have fostered a creative environment that encourages the development of groundbreaking technologies.

Conclusion

Shawna M Lift is a remarkable inventor whose work in microelectronic assemblies has led to significant advancements in the field. Her patents reflect her commitment to innovation and her role in shaping the future of technology.