Shawn M O'Connor

Title: The Innovations of Shawn M O'Connor

Introduction

Shawn M O'Connor is a notable inventor based in Austin, TX, recognized for his contributions to semiconductor technology. He holds a total of 3 patents that showcase his expertise in developing advanced semiconductor package devices.

Latest Patents

One of his latest patents is a semiconductor package device designed for use with multiple integrated circuits in a stacked configuration. This innovative package device features an integrated circuit housed in a cavity within a package substrate, electrically coupled to one side of the substrate. A second integrated circuit is mounted on the opposite side, with the potential for additional integrated circuits to be added. This design includes testing pads on both sides of the package substrate, allowing for pre-encapsulation testing to ensure functionality. Another significant patent is for a packaged semiconductor device that includes a first integrated circuit die mounted in a cavity of a heat spreader. A second die is attached to the first, with both dies connected to a substrate. This configuration enhances thermal dissipation, improving the overall performance of the device.

Career Highlights

Shawn has worked with prominent companies in the semiconductor industry, including Freescale Semiconductor, Inc. and Motorola Corporation. His experience in these organizations has contributed to his innovative approach to semiconductor packaging.

Collaborations

Shawn has collaborated with several professionals in his field, including Mark Allen Gerber and Trent A Thompson. Their combined expertise has likely influenced his work and innovations.

Conclusion

Shawn M O'Connor's contributions to semiconductor technology through his patents and career experiences highlight his role as a significant inventor in the industry. His work continues to impact the development of advanced electronic devices.