The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2005
Filed:
Feb. 07, 2002
Mark A. Gerber, Austin, TX (US);
Shawn M. O'connor, Austin, TX (US);
Trent A. Thompson, Austin, TX (US);
Mark A. Gerber, Austin, TX (US);
Shawn M. O'Connor, Austin, TX (US);
Trent A. Thompson, Austin, TX (US);
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A packaged semiconductor device () has a first integrated circuit die () having a top surface with active electrical circuitry implemented thereon. The first die () is mounted in a cavity () of a first heat spreader (). A second die () having electrical circuitry implemented on a top surface is attached to the top surface of the first die (). Both of the die (and) are electrically connected to a substrate () mounted on the first heat spreader (). A second heat spreader () is mounted on the top surface of the second die (). The second heat spreader () provides an additional path for thermal dissipation of heat generated by the second die ().