This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Arizona State University. Active years: 2015.
Company Filing History:
Years Active: 2015
Title: Shawn David Whaley: Innovator in Wafer Bonding Technologies
Introduction
Shawn David Whaley is a notable inventor based in Tempe, Arizona. He has made significant contributions to the field of materials science, particularly in the area of wafer bonding technologies. His innovative approaches have the potential to advance various applications in semiconductor manufacturing.
Latest Patents
Whaley holds a patent titled "Methods for wafer bonding, and for nucleating bonding nanophases." This patent describes a method for bonding substrates by contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly. The assembly is then compressed in the presence of an oxidizing atmosphere under suitable conditions to create a bonding layer between the two surfaces. Notably, the first bonding surface features a polarized surface layer, while the second bonding surface has a hydrophilic surface layer, highlighting the innovative nature of his work. He has 1 patent to his name.
Career Highlights
Shawn David Whaley is affiliated with Arizona State University, where he contributes to research and development in advanced materials. His work is instrumental in pushing the boundaries of what is possible in wafer bonding techniques.
Collaborations
Whaley has collaborated with esteemed colleagues, including David Alexander Sell and James D. Bradley. These partnerships have fostered a collaborative environment that enhances innovation and research output.
Conclusion
Shawn David Whaley's contributions to wafer bonding technologies exemplify the spirit of innovation in materials science. His work not only advances academic research but also has practical implications for the semiconductor industry.