The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 2015

Filed:

Apr. 30, 2010
Applicants:

Nicole Herbots, Tempe, AZ (US);

Robert J. Culbertson, Tempe, AZ (US);

James Bradley, Gilbert, AZ (US);

Murdock Allen Hart, Tempe, AZ (US);

David Alexander Sell, Tempe, AZ (US);

Shawn David Whaley, Tempe, AZ (US);

Inventors:

Nicole Herbots, Tempe, AZ (US);

Robert J. Culbertson, Tempe, AZ (US);

James Bradley, Gilbert, AZ (US);

Murdock Allen Hart, Tempe, AZ (US);

David Alexander Sell, Tempe, AZ (US);

Shawn David Whaley, Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/18 (2006.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); Y10T 156/10 (2015.01); H01L 33/0079 (2013.01); H01L 21/18 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/94 (2013.01); H01L 25/0657 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/8389 (2013.01); H01L 2224/83894 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01052 (2013.01); H01L 2924/01057 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/07802 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/3025 (2013.01); H01L 2224/2919 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01023 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/01041 (2013.01); H01L 2924/01067 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01072 (2013.01); H01L 2924/01074 (2013.01); H01L 2924/01075 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/0132 (2013.01);
Abstract

Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly; and compressing the assembly in the presence of an oxidizing atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.


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