Company Filing History:
Years Active: 2010-2017
Title: Inventor Profile: Robert Culbertson from Tempe, AZ
Introduction
Robert Culbertson is an accomplished inventor based in Tempe, Arizona. He has made significant contributions in the field of materials science through his innovative methods, leading to a total of four patents to his name. His work primarily focuses on wafer bonding technology.
Latest Patents
Culbertson's latest patents include groundbreaking methods for wafer bonding and for nucleating bonding nanophases using wet and steam pressurization. These methods describe a process that involves contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to create an assembly in the presence of a steam atmosphere. This innovative approach allows for the formation of a bonding layer between the two surfaces, utilizing a polarized surface layer on the first bonding surface and a hydrophilic surface layer on the second bonding surface.
In another patent, he details methods for wafer bonding in an oxidizing atmosphere. Here, again, the first and second bonding surfaces are distinctly different, which enhances the effectiveness of the bonding process. These inventions represent significant advancements in semiconductor manufacturing and materials science.
Career Highlights
Throughout his career, Culbertson has had the opportunity to work with esteemed organizations such as the Arizona Board of Regents, a corporate body acting on behalf of Arizona State University. His role in these institutions has allowed him to collaborate on significant projects focused on innovation in materials engineering.
Collaborations
In his career, Culbertson has worked alongside several notable colleagues, including Nicole Herbots and James D. Bradley. These collaborations have contributed to the success of his research and the development of his patents, highlighting the importance of teamwork in the field of innovation.
Conclusion
Robert Culbertson stands out as a prominent figure in the realm of invention, particularly in the development of wafer bonding technologies. With four patents to his name and a proven track record of contributions to significant research institutions, his ongoing work continues to pave the way for advancements in materials science.