Pleasantville, NY, United States of America

Shawn Anthony Hall

This inventor holds 52 USPTO granted patents and 19 published patent applications, primarily in Cryogenic Quantum Computing (CPC class H01L). Top assignees: International Business Machines Corporation, Globalfoundries Inc., Other. Active years: 1988-2026.

USPTO Granted Patents = 52 (Patent Applications = 19)

% Patents Active = 51.9

Average Co-Inventor Count = 2.8

ph-index = 16

Forward Citations = 1,397(Granted Patents)

Forward Citations (Not Self Cited) = 1,358(Dec 10, 2025)

Inventors with similar research interests:

Location History:

San Jose, CA (US) (2014)
Yorktown Heights, NY (US) (2015 - 2018)
Pleasantville, NY (US) (1988 - 2023)

Company Filing History:

46 out of 166,264

International Business Machines Corporation

4 out of 834,411

Other

patents

Years Active: 1988-2026

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Areas of Expertise:

Cryogenic Quantum Computers

Bump Bonded Chip Assembly

Power Connectors

High-Density Switches

Cooling Techniques

Semiconductor Stack

Electroplated Metal Layer

Thin Wall Heat Sink

Multi-Petascale Supercomputer

LGA Interposer

Memory System Connector

Mechanical Linkage

52 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12658547 - Electroplated metal layer on a niobium-titanium substrate (2026-06-16),

2. 12557210 - Electronic apparatus minimizing differential thermal contraction for cryogenic quantum computers (2026-02-17),

3. 11804442 - Combined backing plate and housing for use in bump bonded chip assembly (2023-10-31),

4. 11735802 - Electroplated metal layer on a niobium-titanium substrate (2023-08-22),

5. 11676903 - Combined backing plate and housing for use in bump bonded chip assembly (2023-06-13),

6. 11131506 - Burst resistant thin wall heat sink (2021-09-28),

7. 10986753 - Water-assisted air cooling for a row of cabinet (2021-04-20),

8. 10833436 - Interdigitated power connector (2020-11-10),

9. 10749817 - High-density, fail-in-place switches for computer and data networks (2020-08-18),

10. 10389654 - High-density, fail-in-place switches for computer and data networks (2019-08-20),

11. 10243285 - Low resistance, low-inductance power connectors (2019-03-26),

12. 10222125 - Burst resistant thin wall heat sink (2019-03-05),

13. 10215504 - Flexible cold plate with enhanced flexibility (2019-02-26),

14. 10068886 - Implementing inverted master-slave 3D semiconductor stack (2018-09-04),

15. 9971713 - Multi-petascale highly efficient parallel supercomputer (2018-05-15),

Title: Innovator Spotlight: Shawn Anthony Hall

Introduction:

Shawn Anthony Hall, a prolific inventor based in Pleasantville, NY, has made significant contributions to the field of electronic chip assembly. With an impressive portfolio of 50 patents, Hall continues to push the boundaries of innovation in the tech industry.

Latest Patents:

1. Combined backing plate and housing for use in bump bonded chip assembly - Hall's revolutionary method involves forming an electronic chip assembly by coupling metal plates to a substrate, creating cavities, and encasing electronic components within those cavities.

2. Electroplated metal layer on a niobium-titanium substrate - Hall's devices and methods facilitate plating metal layers onto niobium-titanium substrates. This innovation opens up new possibilities for various technological applications.

Career Highlights:

Throughout his career, Hall has worked with esteemed companies such as IBM, where he honed his skills and expertise in the field of electronics and semiconductor technology. His innovative solutions have garnered recognition and praise within the industry.

Collaborations:

Hall has collaborated with top-tier professionals in the field, including his coworkers Paul William Coteus and Todd Edward Takken. Together, they have contributed to groundbreaking advancements in electronic chip assembly and materials science.

Conclusion:

Shawn Anthony Hall's dedication to innovation and his remarkable contributions to electronic chip assembly make him a standout figure in the tech industry. His inventive spirit continues to drive progress and inspire future generations of inventors in the field.