International Business Machines Corporation

Other

Globalfoundries Inc.

Shawn Anthony Hall

Paul William Coteus

Todd Edward Takken

Shurong Tian

Gareth Geoffrey Hougham

Mark Delorman Schultz

Kevin Charles Gower

Dale J Pearson

Evan G Colgan

Andrew Ferencz

Gerard Vincent Kopcsay

Valentina Salapura

Dong Chen

Alan G Gara

Philip Heidelberger

Fuad Elias Doany

Martin Ohmacht

Thomas Mario Cipolla

Mark Edwin Giampapa

Matthias Augustin Blumrich

George L Chiu

Krishnan Sugavanam

Rudolf Adriaan Haring

William Louis Luken

Michael K Gschwind

Michael A Blocksome

John Peter Karidis

David William Abraham

Joseph D Ratterman

Adam James Muff

John Michael Cotte

Bruce Martin Fleischer

Alexandre E Eichenberger

Robert William Wisniewski

Thomas M Gooding

John A Gunnels

Burkhard Steinmacher-Burow

Kathryn Mary O'Brien

Mark Gregory Megerian

Sameh W Asaad

John Kevin O'Brien

Thomas Winters Fox

Chen-Yong Cher

Barry Marshall Trager

Peng Wu

Charles David Wait

Alphonso Philip Lanzetta

Sameer Kumar

James Anthony Marcella

Todd Alan Inglett

Jeffrey John Parker

Robert Matthew Senger

Paul Borrel

Noel A Eisley

David L Satterfield

Douglas R Miller

Craig Brian Stunkel

Amith R Mamidala

Frank Suits

Yutaka Sugawara

Kristan D Davis

Jose R Brunheroto

William Pettit Horn

Michael B Mundy

Matthew Roger Ellavsky

James Thomas Klosowski

Robert E Walkup

James Lee Van Oosten

Samuel J Miller

Ioana Maria Martin

Gabor J Dozsa

Ruth Janine Poole

Peter Boyle

Brant L Knudson

Ramon Lane

Ralph E Bellofatto

Norman Christ

Kahn C Evans

Rick A Rand

Warren Edward Maule

Brian E Smith

Kyu-hyoun Kim

Brian Samuel Beaman

Frank Robert Libsch

Hillery C Hunter

Charles Arthur Kilmer

John Samuel Batchelder

Xin Zhang

Robert L Sandstrom

Douglas James Joseph

Theron Lee Lewis

Yu Luo

Jeffrey Vincent Tofano

Ronald Wayne Nunes

Ryan T Gordon

Robert R Jackson

William Joseph Surovic

Istvan Lovas

Amanda E E Mikhail

Kathleen Conlon Hinge

A method for forming an electronic chip assembly. A first metal plate is coupled to a first side of a substrate to form a backing plate. A first cavity is created extending through the substrate to extend at least to the first metal plate. An electronic component is bonded to the substrate such that the electronic component is located within the first cavity. A second metal plate, having a second cavity, is disposed to a second side of the substrate, and over the first cavity such that the electronic component is encased within the first and second cavities by the first and second metal plates.

Combined backing plate and housing for use in bump bonded chip assembly

Devices, systems, and/or methods that can facilitate plating one or more metal layers onto a niobium-titanium substrate are provided. According to an embodiment, a device can comprise a niobium-titanium substrate. The device can further comprise a first metal layer plated on a portion of the niobium-titanium substrate. The device can further comprise a second metal layer plated on the first metal layer. The device can further comprise a third metal layer plated on the second metal layer.

Electroplated metal layer on a niobium-titanium substrate

An method for forming a cooling apparatus for cooling an electronic component. The apparatus has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.

Burst resistant thin wall heat sink

A cooling apparatus and method including a plurality of heat-producing devices positioned in a plurality of cabinets arranged in a row that allows flow of a first fluid through the heat-producing devices and cabinets where the flow is directed from an upstream end of the row to a downstream end of the row. The cabinets have a space therebetween wherein a heat exchanger is positioned between and adjacent to the cabinets, thereby the cabinets and heat exchangers alternate in the row. Each heat exchanger allows flow of a second fluid therethrough for cooling the first fluid. A fluid-moving device is positioned adjacent the heat-producing devices for encouraging flow of the first fluid through the cabinets' heat-producing devices and through the heat exchangers, thereby encouraging heat transfer in each of the heat exchangers from the first fluid to the second fluid.

Water-assisted air cooling for a row of cabinet

An electrical connector carries large amounts of electrical current between two circuit boards with low resistance and low self-inductance by means of an interdigitated anode and cathode, thereby providing low dynamic voltage loss. The connector also may include, near where power will be consumed, an interposer board with on-board capacitance to provide even lower dynamic voltage loss. The connector has application to delivering low-voltage, high-current power from a power supply on a first board to electronics on a second board: the low resistance provides low voltage drop for a load current that is constant, while the low inductance and the capacitors provide low voltage fluctuation for a load current that changes. These issues are of great importance, for example, in designing high-performance computers.

Interdigitated power connector

A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.

High-density, fail-in-place switches for computer and data networks

An electrical connector includes an anode for conducting an electrical supply current from a source to a destination, a cathode for conducting an electrical return current from the destination to the source, and an insulator that prevents electrical conduction between the anode and the cathode. The first and second shapes are such as to provide a conformity of one to the other, with the insulator placed therebetween and having a predetermined relatively thin thickness. A predetermined low-resistance path for the supply current is provided respectively by the anode and the cathode, and a proximity of the anode to the cathode along these paths provides a predetermined low self-inductance of the connector. The anode and the cathode each comprises a plurality of sections that are disposed at one or more predetermined angles to form a rigid assembly that accommodates a geometry between the source and the destination.

Low resistance, low-inductance power connectors

An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.

An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The joined planar top and bottom members have a sidewall structure of reduced height (and generally the height of the cold plate) between active areas in order to improve flexibility. The stiffness of the sidewalls is reduced by very advantageously reduce the height of the sidewalls. In one embodiment, the sidewalls are shorter in height corresponding to regions only between active areas. Alternatively, the sidewalls are of reduced height everywhere by insetting the active areas within the top and/or bottom sheets.

Flexible cold plate with enhanced flexibility

A method and apparatus are provided for implementing an enhanced three dimensional (3D) semiconductor stack. A chip carrier has an aperture of a first length and first width. A first chip has at least one of a second length greater than the first length or a second width greater than the first width; a second chip attached to the first chip, the second chip having at least one of a third length less than the first length or a third width less than the first width; the first chip attached to the chip carrier by connections in an overlap region defined by at least one of the first and second lengths or the first and second widths; the second chip extending into the aperture; and a heat spreader attached to the chip carrier and in thermal contact with the first chip for dissipating heat from both the first chip and second chip.

Implementing inverted master-slave 3D semiconductor stack

A Multi-Petascale Highly Efficient Parallel Supercomputer of 100 petaflop-scale includes node architectures based upon System-On-a-Chip technology, where each processing node comprises a single Application Specific Integrated Circuit (ASIC). The ASIC nodes are interconnected by a five dimensional torus network that optimally maximize the throughput of packet communications between nodes and minimize latency. The network implements collective network and a global asynchronous network that provides global barrier and notification functions. Integrated in the node design include a list-based prefetcher. The memory system implements transaction memory, thread level speculation, and multiversioning cache that improves soft error rate at the same time and supports DMA functionality allowing for parallel processing message-passing.

Multi-petascale highly efficient parallel supercomputer

An electrical connector includes an anode assembly for conducting an electrical supply current from a source to a destination, the anode assembly includes an anode formed into a first shape from sheet metal or other sheet-like conducting material. A cathode assembly conducts an electrical return current from the destination to the source, the cathode assembly includes a cathode formed into a second shape from sheet metal or other sheet-like conducting material. An insulator prevents electrical conduction between the anode and the cathode. The first and second shapes are such as to provide a conformity of one to the other, with the insulator therebetween having a predetermined relatively thin thickness. A predetermined low-resistance path for the supply current is provided by the anode, a predetermined low-resistance path for the return current is provided by the cathode, and the proximity of the anode to the cathode along these paths provides a predetermined low self-inductance of the connector, where the proximity is afforded by the conformity of the first and second shapes.

An apparatus includes a first circuit board including first components including a load, and a second circuit board including second components including switching power devices and an output inductor. Ground and output voltage contacts between the circuit boards are made through soldered or connectorized interfaces. Certain components on the first circuit board and certain components, including the output inductor, on the second circuit board act as a DC-DC voltage converter for the load. An output capacitance for the conversion is on the first circuit board with no board-to-board interface between the output capacitance and the load. The inductance of the board-to-board interface functions as part of the output inductor's inductance and not as a parasitic inductance. Sense components for sensing current through the output inductor are located on the first circuit board. Parasitic inductance of the board-to-board interface has less effect on a sense signal provided to a controller.

Power converter using near-load output capacitance, direct inductor contact, and/or remote current sense

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Pleasantville, NY, United States of America

Shawn Anthony Hall