This inventor holds 1 USPTO granted patent. Top assignee: Koninklijke Philips Corporation N.v.. Active years: 2004.
Company Filing History:
Years Active: 2004
Title: Shatil Haque: Innovator in Multichip Power Packaging
Introduction
Shatil Haque is a notable inventor based in Mohegan Lake, NY (US). He has made significant contributions to the field of integrated circuit packaging. His innovative approach has led to the development of a unique multichip power package that enhances performance and efficiency.
Latest Patents
Shatil Haque holds 1 patent for his invention titled "Folded-flex bondwire-less multichip power package." This invention features a multichip wirebond-less integrated circuit and power die package that utilizes a folded single-layer flex circuit. The design incorporates metal-studbumped power dies and ICs that are flip-chipped to a patterned flex substrate. Extensions of the flex substrate are cleverly folded and attached to the backside of the dies for optimal electrical and thermal contact. The package is designed with I/O pins along the periphery for standard SMT mounting, while heat spreaders are attached to both sides for effective double-sided cooling.
Career Highlights
Shatil Haque is currently employed at Koninklijke Philips Corporation N.V., where he continues to innovate and contribute to advancements in technology. His work focuses on improving the efficiency and functionality of electronic components.
Collaborations
Shatil collaborates with Gert W. Bruning, leveraging their combined expertise to push the boundaries of technology in their field.
Conclusion
Shatil Haque's contributions to multichip power packaging exemplify the spirit of innovation in the electronics industry. His patent reflects a significant advancement that could influence future designs and applications.