Shah Alam, Malaysia

Sharon Huey Lin Tay

This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignees: Freescale Semiconductor,inc., Nxp B.v.. Active years: 2014-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sharon Huey Lin Tay. Retrieved from https://idiyas.com/inventor/sharon-huey-lin-tay

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 50.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2014-2023

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2 patents (USPTO):Explore Patents

Title: The Innovations of Sharon Huey Lin Tay

Introduction

Sharon Huey Lin Tay is a notable inventor based in Shah Alam, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on innovative methods and structures that enhance the performance and reliability of semiconductor devices.

Latest Patents

Sharon's latest patents include a "Semiconductor device under bump structure and method therefor." This patent describes a method of manufacturing a semiconductor device that involves depositing a non-conductive layer over a semiconductor die. An opening is formed in the non-conductive layer, exposing a portion of a bond pad of the semiconductor die. A cavity is created in the non-conductive layer, with a portion of the non-conductive layer remaining between the bottom surface of the cavity and the bottom surface of the non-conductive layer. A conductive layer is then formed over the non-conductive layer and the bond pad, interconnecting the bond pad with a conductive layer portion over the cavity.

Another significant patent is for a "Flexible substrate with crimping interconnection." This invention includes first and second flexible substrates, each with first and second peripheral edges. First and second dies are attached to the respective surfaces of the flexible substrates and are electrically connected to first and second metal traces. A first crimping structure electrically connects the first metal traces to the second metal traces, crimping together the first peripheral edges of the substrates. A second crimping structure performs a similar function for the second peripheral edges.

Career Highlights

Throughout his career, Sharon has worked with prominent companies in the semiconductor industry, including Freescale Semiconductor, Inc. and NXP B.V. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Sharon has collaborated with talented individuals such as Boon Yew Low and Navas Khan Oratti Kalandar. These collaborations have contributed to the advancement of his projects and the successful development of his patents.

Conclusion

Sharon Huey Lin Tay is a distinguished inventor whose work in semiconductor technology has led to valuable innovations. His patents reflect a commitment to enhancing the functionality and efficiency of semiconductor devices. His contributions continue to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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