The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8698288 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 15, 2014

Filed:

May. 23, 2013
Applicants:

Boon Yew Low, Petaling Jaya, MY;

Navas Khan Oratti Kalandar, Petaling Jaya, MY;

Sharon Huey Lin Tay, Shah Alam, MY;

Inventors:

Boon Yew Low, Petaling Jaya, MY;

Navas Khan Oratti Kalandar, Petaling Jaya, MY;

Sharon Huey Lin Tay, Shah Alam, MY;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/04 (2006.01); H01L 25/10 (2006.01); H01L 23/14 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 25/11 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5381 (2013.01); H01L 24/11 (2013.01); H01L 25/117 (2013.01); H01L 23/14 (2013.01); H01L 23/49537 (2013.01); H01L 23/49544 (2013.01); H01L 23/49575 (2013.01); H01L 25/043 (2013.01); H01L 23/5387 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01);
Abstract

A semiconductor device includes first and second flexible substrates each with first and second peripheral edges. First and second dies are attached on respective surfaces of the flexible substrates and are each respectively electrically connected to first and second metal traces. A first crimping structure electrically connects the first metal traces to the second metal traces and crimps together the first peripheral edges of the first and second substrates. A second crimping structure electrically connects the first metal traces to the second metal traces and crimps together the second peripheral edges of the first and second substrates.


Find Patent Forward Citations

Low, Boon. (2014). Flexible substrate with crimping interconnection (U.S. Patent No. 8698288). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8698288

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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